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ISSN 2380-4505
Symposium Proceedings
Vol. 2009, Issue Symposium, 2009June 22, 2026 EDT

3D Integration Technologies for Miniaturized Tire Pressure Monitor System (TPMS)

Nicolas Lietaer, Maaike M. V. Taklo, Armin Klumpp, Josef Weber, Peter Ramm,
3D integrationmicro electromechanical systems (MEMS)integrated circuits (ICs)Miniaturized Tire Pressure Monitor System (TPMS)through silicon vias (TSV)
https://doi.org/10.4071/001c.163731
IMAPSource Conference Papers
Lietaer, Nicolas, Maaike M. V. Taklo, Armin Klumpp, Josef Weber, and Peter Ramm. 2026. “3D Integration Technologies for Miniaturized Tire Pressure Monitor System (TPMS).” IMAPSource Proceedings 2009 (Symposium): 822–29. https://doi.org/10.4071/001c.163731.
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