This section contains the Symposium of Microelectronics Proceedings and various Conferences with techincal papers, all of which are publications of the International Microelectronics And Packaging Society (IMAPS). The Symposium Proceedings are peer-reviewed while other conferences currently are not peer-reviewed. All IMAPS papers tend to concentrate on microelectronics, electronic packaging, heterogeneous integration, SiP, FOWLP, 3D, electronic materials, substrates, surface mount and other related technologies, interconnections, RF and microwaves, wireless communications, manufacturing, design, test, and reliability.
The publications in this section are released according to the IMAPS event scheduling as found at www.imaps.org.
IMAPS members receive complimentary access to the On-line Journal, Symposium/Conference papers, as well as publishing benefits all included with their membership.
Questions? Contact info@imaps.org or 919-293-5000.