A Direct Fanning-out Packaging Technology using Cu Base Plate for Embedded Fine-pad-pitch LSI

Murai, Hideya, Kentaro Mori, Kouji Soejima, Yuji Kayashima, Takehiko Maeda, Takuo Funaya, Katsumi Kikuchi, Katsumi Maeda, Masaya Kawano, and Shintaro Yamamichi. 2026. “A Direct Fanning-out Packaging Technology Using Cu Base Plate for Embedded Fine-Pad-Pitch LSI.” IMAPSource Proceedings 2009 (Symposium): 639–46. https://doi.org/10.4071/001c.162672.