Room Temperature Wedge-Wedge Ultrasonic Bonding using Aluminum Coated Copper Wire

Rainer Dohle; Matthias Petzold; Robert Klengel; Holger Schulze; Frank Rudolf

doi:10.4071/001c.161911

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Dohle, Rainer, Matthias Petzold, Robert Klengel, Holger Schulze, and Frank Rudolf. 2026. “Room Temperature Wedge-Wedge Ultrasonic Bonding Using Aluminum Coated Copper Wire.” IMAPSource Proceedings 2009 (Symposium): 380–87. https://doi.org/10.4071/001c.161911.

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