ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009April 20, 2026 EDT
Characterization of SAC Solder Microstructure Evolution During Thermal Cycling with Statistical and In-situ Methods
Characterization of SAC Solder Microstructure Evolution During Thermal Cycling with Statistical and In-situ Methods
Zhou, Bite, Thomas R. Bieler, Guilin Wu, Stefan Zaefferer, Tae-kyu Lee, and Kuo-Chuan Liu. 2026. “Characterization of SAC Solder Microstructure Evolution During Thermal Cycling with Statistical and In-Situ Methods.” IMAPSource Proceedings 2009 (Symposium): 158–65. https://doi.org/10.4071/001c.160912.