Dispensable 3D Electrical Interconnects - A Near TSV Back end Packaging Solution

Leal, Jeff, Suzette Pangrle, Scott McGrath, Grant Villavicencio, Keith Barrie, and Simon McElrea. 2026. “Dispensable 3D Electrical Interconnects - A Near TSV Back End Packaging Solution.” IMAPSource Proceedings 2009 (Symposium): 572–78. https://doi.org/10.4071/001c.162595.