HotPak: A Tool For Rapid Thermal Mapping & Leakage Power Analysis of Flip-Chip Packages

Sai Ankireddi; David Copeland; Stanley Pecavar

doi:10.4071/001c.161848

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Ankireddi, Sai, David Copeland, and Stanley Pecavar. 2026. “HotPak: A Tool For Rapid Thermal Mapping & Leakage Power Analysis of Flip-Chip Packages.” IMAPSource Proceedings 2009 (Symposium): 233–37. https://doi.org/10.4071/001c.161848.

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