ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009May 07, 2026 EDT
Study of Formation and Change of Intermetallic Compounds in Cu-Au and Au-Al Systems for Copper on Gold Bonding
Study of Formation and Change of Intermetallic Compounds in Cu-Au and Au-Al Systems for Copper on Gold Bonding
Jiang, Yingwei, Youmin Yu, Weimin Chen, Sonder Wang, and Ronglu Sun. 2026. “Study of Formation and Change of Intermetallic Compounds in Cu-Au and Au-Al Systems for Copper on Gold Bonding.” IMAPSource Proceedings 2009 (Symposium): 394–400. https://doi.org/10.4071/001c.161914.