ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009April 28, 2026 EDT
Mechanically Punched Micro Via Fabrication Process in LCP Substrate for RF-MEMS and Related Electronic Packaging Applications
Mechanically Punched Micro Via Fabrication Process in LCP Substrate for RF-MEMS and Related Electronic Packaging Applications
Chowdhury, Mohammad K., Li Sun, Shawn Cunningham, and Ajay P. Malshe. 2026. “Mechanically Punched Micro Via Fabrication Process in LCP Substrate for RF-MEMS and Related Electronic Packaging Applications.” IMAPSource Proceedings 2009 (Symposium): 174–80. https://doi.org/10.4071/001c.161407.