ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009April 20, 2026 EDT
Impact of SMT Assembly Process on Tin Whisker Risk Mitigation
Impact of SMT Assembly Process on Tin Whisker Risk Mitigation
Lee, Chieh-Ju, Guhan Subbarayan, Li Li, Jie Xue, Peter Verbiest, and Quyen Chu. 2026. “Impact of SMT Assembly Process on Tin Whisker Risk Mitigation.” IMAPSource Proceedings 2009 (Symposium): 120–27. https://doi.org/10.4071/001c.160907.
