Break Down Failure Process of the Flip Chip Bumps Caused by Current Stressing

Shigeaki Suganuma; Toshio Gomyo; Yuya Yamagishi; Kei Imafuji; Masaki Sanada; Yuko Karasawa; Kei Murayama; Takashi Kurihara; Yukiharu Takeuchi

doi:10.4071/001c.161905

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Suganuma, Shigeaki, Toshio Gomyo, Yuya Yamagishi, Kei Imafuji, Masaki Sanada, Yuko Karasawa, Kei Murayama, Takashi Kurihara, and Yukiharu Takeuchi. 2026. “Break Down Failure Process of the Flip Chip Bumps Caused by Current Stressing.” IMAPSource Proceedings 2009 (Symposium): 346–53. https://doi.org/10.4071/001c.161905.

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