ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009April 28, 2026 EDT
Mechanical Analysis on Ball Bond Lifting of Wire Bonding in an LED Package for Backlight Unit
Mechanical Analysis on Ball Bond Lifting of Wire Bonding in an LED Package for Backlight Unit
Kim, Jong Woon, Shan Gao, Si Joong Yang, and Seog Moon Choi. 2026. “Mechanical Analysis on Ball Bond Lifting of Wire Bonding in an LED Package for Backlight Unit.” IMAPSource Proceedings 2009 (Symposium): 923–30. https://doi.org/10.4071/001c.161412.