Numerical Analysis of Ultra-High Frequency Wire Bonding

M. Mayer; Y. Huang

doi:10.4071/001c.161913

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Mayer, M., and Y. Huang. 2026. “Numerical Analysis of Ultra-High Frequency Wire Bonding.” IMAPSource Proceedings 2009 (Symposium): 388–93. https://doi.org/10.4071/001c.161913.

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