Underfill Selection for Flip Chip BGA Warpage Control

Lin, Antony, CY Li, Meng-Kai Shih, Yi-Shao Lai, Bernd Appelt, and Andy Tseng. 2026. “Underfill Selection for Flip Chip BGA Warpage Control.” IMAPSource Proceedings 2009 (Symposium): 1018–23. https://doi.org/10.4071/001c.161488.