ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009May 11, 2026 EDT
Component Level Testing of Application Specific Conditions for Pressure Sensitive Adhesive Thermal Interface Materials
Component Level Testing of Application Specific Conditions for Pressure Sensitive Adhesive Thermal Interface Materials
Chu, Herman, and Anusha Selvakumar. 2026. “Component Level Testing of Application Specific Conditions for Pressure Sensitive Adhesive Thermal Interface Materials.” IMAPSource Proceedings 2009 (Symposium): 464–69. https://doi.org/10.4071/001c.162067.