ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009April 28, 2026 EDT
Impact of Metal Fill on On-Chip Interconnect Performance
Impact of Metal Fill on On-Chip Interconnect Performance
Shilimkar, Vikas S., Steven G. Gaskill, and Andreas Weisshaar. 2026. “Impact of Metal Fill on On-Chip Interconnect Performance.” IMAPSource Proceedings 2009 (Symposium): 983–90. https://doi.org/10.4071/001c.161426.