ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009June 22, 2026 EDT
A Design Rule for 3D TSV Technology to Avoid Radial Cracking in Silicon Interposer
A Design Rule for 3D TSV Technology to Avoid Radial Cracking in Silicon Interposer
Zhang, Zhen. 2026. “A Design Rule for 3D TSV Technology to Avoid Radial Cracking in Silicon Interposer.” IMAPSource Proceedings 2009 (Symposium): 744–49. https://doi.org/10.4071/001c.163707.