Impact of Thermal History on Gap Filling Capability of Die Attach Film

Yeqing Su; Wei Shen; Weimin Chen; Denis Bai; Vitto Huang; Baoguan Yin; Sonder Wang

doi:10.4071/001c.162077

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Su, Yeqing, Wei Shen, Weimin Chen, Denis Bai, Vitto Huang, Baoguan Yin, and Sonder Wang. 2026. “Impact of Thermal History on Gap Filling Capability of Die Attach Film.” IMAPSource Proceedings 2009 (Symposium): 511–15. https://doi.org/10.4071/001c.162077.

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