ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009May 11, 2026 EDT
Advanced Wafer-Level Integration Technology with Ultra Fine Pitch Redistributed Layers Between Heterogeneous Devices
Advanced Wafer-Level Integration Technology with Ultra Fine Pitch Redistributed Layers Between Heterogeneous Devices
Onozuka, Yutaka, Hiroshi Yamada, Atsuko Iida, Kazuhiko Itaya, and Hideyuki Funaki. 2026. “Advanced Wafer-Level Integration Technology with Ultra Fine Pitch Redistributed Layers Between Heterogeneous Devices.” IMAPSource Proceedings 2009 (Symposium): 500–507. https://doi.org/10.4071/001c.162075.