Loading [Contrib]/a11y/accessibility-menu.js

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search
  • LinkedIn (opens in a new tab)
  • RSS feed (opens a modal with a link to feed)

RSS Feed

Enter the URL below into your favorite RSS reader.

https://imapsource.org/feed
ISSN 2380-4505
Symposium Proceedings
Vol. 2009, Issue Symposium, 2009May 29, 2026 EDT

Investigation of SiC Power Module Requirements for Smart Grid Applications

Yuanbo Guo, Pitfee Jao, Gangyao Wang, Yu Du, Subbashish Bhattacharya, Douglas C. Hopkins,
packagingSiC Power Module RequirementsSmart Grid Applications
https://doi.org/10.4071/001c.162682
IMAPSource Conference Papers
Guo, Yuanbo, Pitfee Jao, Gangyao Wang, Yu Du, Subbashish Bhattacharya, and Douglas C. Hopkins. 2026. “Investigation of SiC Power Module Requirements for Smart Grid Applications.” IMAPSource Proceedings 2009 (Symposium): 686–92. https://doi.org/10.4071/001c.162682.
Save article as...▾

View more stats

Powered by Scholastica, the modern academic journal management system