The Challenge in Packaging Microelectronics and Optoelectronics

Rick C. Stevens; Fahad M. Siddiqui; Brian L. Uhlhorn; Kevin J. Thorson

doi:10.4071/001c.162055

Loading [Contrib]/a11y/accessibility-menu.js

Stevens, Rick C., Fahad M. Siddiqui, Brian L. Uhlhorn, and Kevin J. Thorson. 2026. “The Challenge in Packaging Microelectronics and Optoelectronics.” IMAPSource Proceedings 2009 (Symposium): 413–19. https://doi.org/10.4071/001c.162055.

View more stats