ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009June 22, 2026 EDT
High Accuracy Placement Enabling High Density and Fine Pitch in 3D-IC with High Density TSV, with Chip to Wafer (C2W) Bonding Approach
High Accuracy Placement Enabling High Density and Fine Pitch in 3D-IC with High Density TSV, with Chip to Wafer (C2W) Bonding Approach
Lecarpentier, Gilbert, Jean Stephane Mottet, and François Marion. 2026. “High Accuracy Placement Enabling High Density and Fine Pitch in 3D-IC with High Density TSV, with Chip to Wafer (C2W) Bonding Approach.” IMAPSource Proceedings 2009 (Symposium): 813–16. https://doi.org/10.4071/001c.163729.