ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009April 28, 2026 EDT
Inkjet Printing Approach to Fabricate Non-sintered Dielectric Film with High Packing Density for 3D Package Integration Technology
Inkjet Printing Approach to Fabricate Non-sintered Dielectric Film with High Packing Density for 3D Package Integration Technology
Kim, Jihoon, Hun Woo Jang, Eunhae Koo, Hyo Tae Kim, Young Joon Yoon, and Jong-hee Kim. 2026. “Inkjet Printing Approach to Fabricate Non-Sintered Dielectric Film with High Packing Density for 3D Package Integration Technology.” IMAPSource Proceedings 2009 (Symposium): 1016–17. https://doi.org/10.4071/001c.161438.