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ISSN 2380-4505
Symposium Proceedings
Vol. 2009, Issue Symposium, 2009May 07, 2026 EDT

Second Bond Stitch Width Model as a Trend Solution for Lead Width Reduction

Tomer Levinson, Menache Alon, Shi Fei,
wire bondingcapillary designwire diameter reductionfine pitch leadsand model
https://doi.org/10.4071/001c.161908
IMAPSource Conference Papers
Levinson, Tomer, Menache Alon, and Shi Fei. 2026. “Second Bond Stitch Width Model as a Trend Solution for Lead Width Reduction.” IMAPSource Proceedings 2009 (Symposium): 360–66. https://doi.org/10.4071/001c.161908.
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