ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009May 27, 2026 EDT
A Cost-Effective PVD Thin Film Deposition System for the 3-D TSV Barrier/Seed Application
A Cost-Effective PVD Thin Film Deposition System for the 3-D TSV Barrier/Seed Application
Wang, Alex, Biju Ninan, Pramod Gupta, and Ravi Mullapudi. 2026. “A Cost-Effective PVD Thin Film Deposition System for the 3-D TSV Barrier/Seed Application.” IMAPSource Proceedings 2009 (Symposium): 569–71. https://doi.org/10.4071/001c.162594.