New Methods for Mechanical Mating Characterization of Surface Mount Technology Card to Board Interconnections

John G. Torok; William L. Brodsky; Shawn Canfield; Hien P. Dang; David L. Edwards; Mark K. Hoffmeyer; Vijay Khanna; Eric J McKeever; Arvind K. Sinha; Sri Sri-Jayantha

doi:10.4071/001c.161494

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Torok, John G., William L. Brodsky, Shawn Canfield, Hien P. Dang, David L. Edwards, Mark K. Hoffmeyer, Vijay Khanna, Eric J McKeever, Arvind K. Sinha, and Sri Sri-Jayantha. 2026. “New Methods for Mechanical Mating Characterization of Surface Mount Technology Card to Board Interconnections.” IMAPSource Proceedings 2009 (Symposium): 1054–61. https://doi.org/10.4071/001c.161494.

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