ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009May 27, 2026 EDT
Critical Issues of 3D High-Performance IC Integrations
Critical Issues of 3D High-Performance IC Integrations
Articles in Vol. 2009, Issue Symposium, 2009
Vol. 2009, Issue Symposium, 2009
- A New Type of Reconfigurable Antenna for Multi-band Wireless CommunicationChang-Chih LiuKuo-Chiang ChinWei-Ting ChenChang-Sheng ChengLi-Chi Chang
- The Design and Integration of a Quasi-Distributed Tunable UHF FilterEric E. HoppenjansWilliam J. Chappell
- A Process to Produce Low Cost Solder Balls in Custom SizesFred HaringJacob BaerSyed Sajid AhmadAaron Reinholz
- Modeling and Analysis of Electromagnetic Field Distribution in Vicinity of Patch Antennas at Millimeter-wave FrequenciesFlorian OhnimusIvan NdipEge EnginStephan GuttowskiHerbert Reichl
- Halogen Free and Thermal Stable Novolac Derivatives and Their Properties in Epoxy CompositesH. H. WuW. T. YangS. F. LiuC. C. Shieh
- Design and Integration of a Planar EBG for UWB ApplicationsIvan NdipMicha BierwirthEge EnginStephan GuttowskiHerbert Reichl
- Deposition of Thick Film Fine Line Patterns by Direct WritingMartin BursikJirí HladíkIvan Szendiuch
- The Cleaning Effectiveness in Electronics Assembly ProcessVladimír SítkoMichal ŠafferIvan SzendiuchMartin Buršík
- Intelligent Power Grid Simulation Hardware DesignJohn C. Browne Jr.Sean DevensSean JainarineOrlando GonsalvesSon NguyenZ. Joan Delalic
- What Is Halide-Free and What Does It Mean to Me?John C. Vivari
- Evaluation of the Ball Grid Array (BGA) Technology with a View to the Space-use ApplicationKoichi ShinozakiNorio NemotoTsuyoshi NakagawaYoshihiro Tokue
- Decision Matrix as a Tool for Pb-Free Alloy SelectionPedro O. QuinteroRicky ValentínDavid Ma
- An Investigation of Materials Selection and Manufacturing Process on Resulted Device Alpha Emissivity LevelsPeng SuRick WongShi-Jie WenAndy TsengJimmy ChenSimon Li
- A New Technique for Testing Copper Stud BumpsStephen ClarkAlan King
- An Interconnection Verification Method and a New Substrate Option for Cu Pillar Flip-chip Module ApplicationsScott MorrisJon ChadwickTerry GlascockJohn CzarnowskiMike FerraraDon LeahyShannon Pan
- Electromigration and Annealing Kinetics of Cu pillarMyeong-Hyeok JeongJae-Won KimGi-Tae LimByoung-Joon KimKiwook LeeJaedong KimYoung-Chang JooYoung-Bae Park
- Design and Process of 3D MEMS PackagingJohn H. Lau
- LCP Properties Ideal for Miniaturization Trend in Electronic IndustryEdson Ito
- High Density Hearing Aid Chip PackagingJohn DzarnoskiDoug Link
- Physiological Monitoring by “Credit Card”Harry K. Charles Jr.Russell P. Cain
- Multiple Gas Sensing Device Based on Nano-Porous Structure of Zeolite Coated with Nile Red DyeSon NguyenZ. Joan DelalicDavid M. KargboZameer Hasan
- Characterization of Extent of Cure of Form-in-Place CompoundsHui YeClaudine LumibaoDouglas S. McBain
- Modeling and Analysis of a New Packaging Structure for Noise Isolation in Mixed- Signal SystemsIvan NdipStephan GuttowskiHerbert Reichl
- A Practical Shielding Effectiveness Evaluation of EcE Gaskets Incorporating Accelerated AgingDouglas S. McBainTam ChauShelby BallRobert Antonio
- The Hidden Component of High Speed Filter Design: The Footprint InfluenceA. RahmanM. BromanM. Howieson
- Compression Force of a Form-In-Place (FIP) Conductive Elastomer EMI Shielding Gaskets: Theory, Measurement Techniques, and ApplicationHui YeClaudine Y. LumibaoDouglas S. McBain
- A Study of the Influence of FIP Bead Shape on Compression Force in PCB/Shield AssembliesClaudine Y. LumibaoHui YeDouglas S. McBain
- Evaluation of Electroless Nickel Electroless Palladium (ENEP) finish as a replacement for Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) for Gold Wirebonding and SAC305 SolderabilityJaspreet GandhiShijian LuoTom Jiang
- New PCB Materials for Low Skew Close Phase Matching in 10Gbps Differential System DesignsEdward P. SayreSunichi MaedaShinji Yoshikawa
- High-performance Optical Silicone for High Power LED packagesYeong-Her LinJiun Pyng YouFrank G. Shi
- Fabrication of 3-D Microstructures with Permanent Dielectric Dry FilmTobias BaumgartnerKarin HauckKai ZoschkeMichael TöpperHidetaka UnoWerner LiebschHao YunMats J. EhlinKarl H. Dietz
- The Effect of Test Conditions on HAST and THB Reliability Testing of Thermal Interface Material, and the Introduction of an Improved Thermal Interface MaterialAndy DelanoNatalie MerrillRichard Xu
- Crystallographic Texture and Whisker Growth in Electroplated Sn and Sn-Alloy FilmsAaron PedigoPylin SarobolJohn BlendellPeng SuCarol Handwerker
- Impact of SMT Assembly Process on Tin Whisker Risk MitigationChieh-Ju LeeGuhan SubbarayanLi LiJie XuePeter VerbiestQuyen Chu
- Comparison of Whisker Growth from Pressure-Induced and Environment-Induced Whisker Growth Test MethodsMichael OstermanLyudmyla PanashchenkoAlex HeronimePeng Su
- Case Study: Bright Tin Whisker Risk in PB-free Connector ApplicationsJames HenziCJ LeeDamon NorthropHongtao MaTae-kyu LeeBill ReynoldsMason Hu
- Grain Orientation and Microstructure Evolution in Sn-Ag-Cu Solder Joints as a Function of Position in Ball Grid Array PackagesTae-Kyu LeeBite ZhouLauren BlairKuo-Chuan LiuThomas R. Bieler
- Effect of Germanium addition to Sn3.5Ag Lead Free Solder System for Overall BGA Package Robustness ImprovementEu Poh LengWong Tzu LingMin DingNowshad AminIbrahim AhmadTay Yee HanA.S.M.A. Haseeb
- Characterization of SAC Solder Microstructure Evolution During Thermal Cycling with Statistical and In-situ MethodsBite ZhouThomas R. BielerGuilin WuStefan ZaeffererTae-kyu LeeKuo-Chuan Liu
- Low-Cost and Reliable Packaging Technology for Stacked MCP with MEMS and Control IC ChipsMitsuyoshi EndoAkihiro KojimaYoshiaki ShimookaYoshiaki SugizakiHiroaki YamazakiEtsuji OgawaTamio IkehashiTatsuya OhguroSusumu ObataYusaku AsanoTakeshi MiyagiIkuo MoriYoshiaki ToyoshimaHideki Shibata
- Mechanically Punched Micro Via Fabrication Process in LCP Substrate for RF-MEMS and Related Electronic Packaging ApplicationsMohammad K. ChowdhuryLi SunShawn CunninghamAjay P. Malshe
- Analysis of MEMS Structure Sidewalls for Carbon and Fluorinated Residue with SEM, EDS and TSAColin StevensRobert DeanLee Levine
- Design of Multiwall Carbon Nanotube Based Embedded InductorsBruce C. Kim
- Near Chip Scale Package for High Power, Big Chip LEDsPaul J. PanaccioneJay G. Liu
- Mechanical Analysis on Ball Bond Lifting of Wire Bonding in an LED Package for Backlight UnitJong Woon KimShan GaoSi Joong YangSeog Moon Choi
- Polarization Recycling LED Module for Pico ProjectorY. ChiW.P. TangS.L. ChenC.J. Tsai
- Determination of Optimal Component Spacing in a High Power Light Emitting Diode Array Assembly for Solid State LightingY. S. ChanS. W. Ricky Lee
- Void-Free Fluxless Solder Bonding of CPV Solar CellsWei ShiPaul J. BarnesDavid Muhs
- Parallel Algorithms for Power and Signal Integrity Analysis of High-Speed DesignsR. AcharH. DhindsaN. NakhlaD. PaulM. Nakhla
- Full-Wave Electromagnetic Characterization and Measurement of Wirebond Transitions on High Temperature Co-fired Ceramics (HTCC) and Low Temperature Co-fired Ceramic (LTCC) Substrates For Broadband Package DesignsJerry AguirreMarcos VargasJason BastDavid O’NeillSteve HiraChen Wang
- Embedding the Footprint into Very High Frequency Surface Mount Components through De-embedding OptimizationA. RahmanM. BromanM. Howieson
- Comprehensive Multilayer Substrate Models for Co-Simulation of Power and Signal IntegrityRenato Rimolo-DonadioXiaomin DuanHeinz-Dietrich BrünsChristian Schuster
- Reduction of Signal Line to Power Plane Coupling Using Controlled-Return-Current Transmission LinesA. Ege EnginIvan Ndip
- Impact of Metal Fill on On-Chip Interconnect PerformanceVikas S. ShilimkarSteven G. GaskillAndreas Weisshaar
- Improvement of Adhesion and Reliability of Conductive Inks on Flexible Liquid Crystal Polymer SubstratesD. MuseS. PritchardE. MacDonaldR. WickerX. ChenM. NewtonK.H. Church
- Polymer Nanocomposites, Printable and Flexible Technology for Electronic PackagingRabindra N. DasFrank D. EgittoBill WilsonMark D. PoliksVoya R. Markovich
- Direct Print Technology for Fabricating Mechanical SensorsXudong ChenKen ChurchDan MuseDavid RobersonMiguel AlamilloEric E. MacDonaldRyan WickerHelena RonkainenSimo VarjusJukka Paro
- Low Temperature Sintering Nanoparticle Inks for Printed Electronic DevicesZhihao YangZhiyong XuLiwei HuangHoward Wang
- Evaluation of Tool for Processing Metallic Conductive Inks on Low Temperature SubstratesS. FarnsworthI. RawsonK. MartinK. A. SchroderD. Pope
- Inkjet Printing Approach to Fabricate Non-sintered Dielectric Film with High Packing Density for 3D Package Integration TechnologyJihoon KimHun Woo JangEunhae KooHyo Tae KimYoung Joon YoonJong-hee Kim
- Underfill Selection for Flip Chip BGA Warpage ControlAntony LinCY LiMeng-Kai ShihYi-Shao LaiBernd AppeltAndy Tseng
- Flip Chip Process Using the Cu-Sn-Cu Double-Pillar-Bump BondingJung-Yeol ChoiMin-Young KimTae-Sung Oh
- Improvement in Flip-Chip Bonding by Reduction of Oxides Using Hydrogen RadicalsTsuyoshi NakashimaKoji MiyamotoMichihiro SatoKanta NogitaAkira Izumi
- Laser Based Assembly of Ultra Fine Pitch Bumped ICs For Chip-on-Chip Proximity Coupled ApplicationsAndrew StrandjordThorsten TeutschGhassem AzdashtMatt Giere
- Electromigration Study of μPILR™ Platform for Fine-Pitch Flip chip InterconnectsPiyush SavaliaRajesh KatkarYoshikuni NakadairaKyongmo BangBahareh BanijamaliIlyas MohammedLaura Mirkarimi
- Thermosonic Gold to Gold Interconnect (GGI) Flip Chip Bonding for 7mm2 DiePhilip Couts
- New Methods for Mechanical Mating Characterization of Surface Mount Technology Card to Board InterconnectionsJohn G. TorokWilliam L. BrodskyShawn CanfieldHien P. DangDavid L. EdwardsMark K. HoffmeyerVijay KhannaEric J McKeeverArvind K. SinhaSri Sri-Jayantha
- Production Measurement of Frequency Dependent Attenuation and Phase Constant of PCB TracesJohn DiTucciRoger Krabbenhoft
- A Case Study of the Impact of Fabrication Processes on PCB Broadband Electrical CharacteristicsJason LinAlbert HuangOhio HuangSteven Chen
- A Comparative Study of Microstrip, Stripline and Coplanar Lines on Different Substrate Technologies for High-Performance ApplicationsRobert ErxlebenIvan NdipLars BrusbergHenning SchröderMichael TöpperWolfgang ScheelStephan GuttowskiHerbert Reichl
- Newly Developed Low-Transmission-Loss Multilayer Materials for PWBs Applied to High GHz BandsHikari MuraiYasuyuki MizunoHiroshi ShimizuMakoto (Mak) KatoKenichi (Ken) Ikeda
- A Novel Halogen Free and Low Dk/Df Laminate Material for High Frequency ApplicationSanny HeBill Weng
- A Novel Green Process to Manufacture Ultra High Density Packaging SubstratesChih Kuang Yang
- Reliability Evaluation of Lead-Free Solders for Automotive ApplicationsY.K. SaYeong K. KimJunghwan BangJunki KimSehoon YooChangwoo Lee
- Prognostication For Impending Failure in Leadfree Electronics Subjected to Shock and Vibration Using Resistance SpectroscopyPradeep LallRyan LoweJeff SuhlingKai Goebel
- Component Quality Defects: Identification, Investigation & RemediationD. Michael Flint
- A High-Temperature, High-Voltage Linear Regulator in 0.8-μm BCD-on-SOIC. SuM. A HuqueB. J. BlalockS. K. IslamL. M. TolbertR. L. Greenwell
- Effect of Vibration on Lead-Free Solder Joint Reliability Under Temperature Changes for Automotive ElectronicsSehoon YooY.K. SaYeong K. KimSanghyun KwonChangWoo Lee
- A High-Temperature, High-Voltage SOI Gate Driver IC with High Output Current and On-Chip Low-Power Temperature SensorMohammad A. HuqueLeon M. TolbertBenjamin J. BlalockSyed K. Islam
- Thermal System Identification Analyses of Chip Interconnects to Facilitate DVFS ImplementationSai AnkireddiDavid Copeland
- HotPak: A Tool For Rapid Thermal Mapping & Leakage Power Analysis of Flip-Chip PackagesSai AnkireddiDavid CopelandStanley Pecavar
- Vaporizable Dielectric Fluid Cooling of IGBT Power SemiconductorsDavid L. Saums
- Thermal Management of a Planar Magnetic Micro-TransformerYazdan P. RaziBob Roohparvar
- A Stochastic Coolability Analysis For A Microprocessor Considering Chip Power FluctuationSai Ankireddi
- Characterization of LTCC Material at G-bandNurul OsmanRobert LeighCharles Free
- Thermomechanical Finite Element Techniques in Multilayer Ceramic Package DesignMark EblenNobuo TakeshitaFranklin Kim
- DuPontTM Green TapeTM 9K7 Low Temperature Co-fired Ceramic (LTCC) Low Loss Dielectric System for High Frequency ApplicationsK.E. SoudersK.M. NairM.F. McCombsJ.M. ParisiD.M. Nair
- Effect of Stress on the Densification of a Low-Temperature Cofired Ceramic (LTCC) System Under Constrained SinteringJui-Chuan ChangJau-Ho JeanYao-Yi Hung
- LTCC Ka-Band Switch Matrix Experiment for On-Orbit VerificationS. HumblaJ. MüllerR. StephanD. StöpelJ.F. TrabertG. VogtM.A. Hein
- New Plateable Thick Film Silver Conductors for DuPont™ Green Tape™ Low Temperature Co-Fired Ceramic (LTCC)Michael A. SkurskiK. M. NairDavid Shields
- Development of an AlN HTCC Multilayer System with a Tungsten Cofiring MetallizationBernd JoedeckeMarco FritschChristel KretzschmarLars RebenklauAlexander Michaelis
- Environmental Conditions Impacts on PB-Free Solder Joint ReliabilityBo LiuTae-Kyu LeeKuo-Chuan Liu
- Lead-Free Solder-Joint-Reliability Model EnhancementJian MiremadiGreg HenshallAileen AllenElizabeth BenedettoMichael Roesch
- Advanced Lead-Free Server Hardware Reliability Test Methods: Power Age / Power Cycling and Four Point Bend Test Data ResultsMatthew KellyTimothy YoungerDavid Braun
- Effect of Temperature Cycling Parameters on the Durability of Pb-free SoldersMichael OstermanPreeti Chauhan
- Au-Ge based Candidate Alloys for High-Temperature Lead-Free Solder AlternativesVivek ChidambaramJohn HaldJesper Hattel
- Break Down Failure Process of the Flip Chip Bumps Caused by Current StressingShigeaki SuganumaToshio GomyoYuya YamagishiKei ImafujiMasaki SanadaYuko KarasawaKei MurayamaTakashi KuriharaYukiharu Takeuchi
- Effects of Solder Voids on Thermal and Reliability Performances of PQFN PackagesYoumin YuVictor A. Chiriac
- Second Bond Stitch Width Model as a Trend Solution for Lead Width ReductionTomer LevinsonMenache AlonShi Fei
- Accelerated Characterization of Bonding Wire MaterialsA. PequegnatM. MayerJ. PersicY. Zhou
- Practical Considerations for PowerRibbon® Bonding of Hybrid PackagesRichard Elliott
- Room Temperature Wedge-Wedge Ultrasonic Bonding using Aluminum Coated Copper WireRainer DohleMatthias PetzoldRobert KlengelHolger SchulzeFrank Rudolf
- Numerical Analysis of Ultra-High Frequency Wire BondingM. MayerY. Huang
- Study of Formation and Change of Intermetallic Compounds in Cu-Au and Au-Al Systems for Copper on Gold BondingYingwei JiangYoumin YuWeimin ChenSonder WangRonglu Sun
- Odd-Form Factor Package Wire Bond Case StudiesDaniel D. Evans
- Solder Jetting - A Versatile Packaging and Assembly Technology for Hybrid Photonics and Optoelectronical SystemsErik BeckertThomas R. OppertGhassem AzdashtElke ZakelThomas R. BurkhardtMarcel HornaffIngo ScheidigRamona EberhardtAndreas TünnermannFrank Buchmann
- The Challenge in Packaging Microelectronics and OptoelectronicsRick C. StevensFahad M. SiddiquiBrian L. UhlhornKevin J. Thorson
- Micron Level Placement Accuracy for Wafer Scale Packaging of P-Side Down Lasers in Optoelectronic ProductsDaniel D. Evans Jr.Zeger Bok
- Modeling Residual Stresses in Epoxies During CoolingRaymond A. PearsonSalvatore S. Cimorelli
- Laser Scribing of Copper/Low-k Dielectric Semiconductor Materials by Nanosecond and Ultrafast Pulsewidth LasersA. HooperD. BarsicH. ZhangJ. O’Brien
- Indium Thermal Interface Material Assembly Manufacturability and ReliabilitySean S. TooMohammad KhanEdwin GohXiaole ZhoaKee-Hean Keok
- Evaluation of a Novel Dielectric Material for Aluminum SubstratesMichael CreamerMark ChallingsworthSamson Shahbazi
- High-Quality CO2 Laser Machining of LTCC Structures for Thermal Management of a Group of Single-Emitter Laser DiodesAlberto Campos ZatarainAaron McKay McKayHoward J BakerDenis R HallMarc Desmulliez
- High Temperature Stamping Forging to Fabricate Fully Densified Copper Tungsten and Copper Molybdenum Heat Sink MaterialsGuosheng JiangZhifa WangYi GuKen Kuang
- Component Level Testing of Application Specific Conditions for Pressure Sensitive Adhesive Thermal Interface MaterialsHerman ChuAnusha Selvakumar
- Process and Reliability Advantages of AuSn Eutectic Die-AttachAmanda HartnettSteve Buerki
- Reliability Study of the Bump on Flexible Lead for Wafer Level PackagingI. KolbM. J. WolfO. EhrmannH. Reichl
- Development of Wafer Level Embedded SiP (System in Package) for Mobile ApplicationIn-Soo KangGi-Jo JungByoung-Yool Jeon
- Enhance Solder Ball Shear Value in SiP Embedded PackagesDyi-Chung Hu
- Microspring Characterization and Flip Chip Assembly ReliabilityB. J. ChengE.M. ChowD. DeBruykerC. ChuaK. SahasrabuddheI. ShubinJ. CunninghamY. LuoA. V. Krishnamoorthy
- Advanced Wafer-Level Integration Technology with Ultra Fine Pitch Redistributed Layers Between Heterogeneous DevicesYutaka OnozukaHiroshi YamadaAtsuko IidaKazuhiko ItayaHideyuki Funaki
- On the Use of Nanoscale Materials to Toughen Model EpoxiesR. A. PearsonP. DittanetL. BacigalupoY.-L. LiangR. Oldak
- Impact of Thermal History on Gap Filling Capability of Die Attach FilmYeqing SuWei ShenWeimin ChenDenis BaiVitto HuangBaoguan YinSonder Wang
- Reliability Impact of Defects in Lead-Free BGA Solder Joints – A Systematic StudyAnurag BansalKuo-Chuan LiuJie XueDave Towne
- A Test Platform for the Thermal, Electrical, and Mechanical Characterization of PackagesJustin SchauerNathaniel PinckneyNyles NettletonDarko Popovic
- Use of the Skin Effect for Detection of Interconnect DegradationMichael H. AzarianDaeil KwonMichael Pecht
- Effects of PCB Design Variations on the Reliability of Lead-Free Solder JointsHongtao MaKuo-Chuan LiuDong Hyun KimCherif Guirguis
- Warpage Control of Thermally Enhanced PBGA Package with Internal Heat Spreader during Reliability TestMin DingBY LowJames GuajardoHarold DowneySheila Chopin
- Analysis of Pb-free BGA Solder Joint Reliability DataWeidong XieMichael TsaiKuo-Chuan Liu
- A Coupling between Electromigration(EM) and Kirkendall Effect in Sn-3.5Ag/Cu Solder JointH.W. KangJin YuY. Jung
- Lithography and Wafer Bonding Solutions for 3D IntegrationThorsten MatthiasBioh KimEric PaboDustin WarrenMarkus WimplingerPaul Linder
- A Cost-Effective PVD Thin Film Deposition System for the 3-D TSV Barrier/Seed ApplicationAlex WangBiju NinanPramod GuptaRavi Mullapudi
- Dispensable 3D Electrical Interconnects - A Near TSV Back end Packaging SolutionJeff LealSuzette PangrleScott McGrathGrant VillavicencioKeith BarrieSimon McElrea
- Wafer Level Batch Fabrication of Silicon Microchannel Heat Sink and Electrical Through-Silicon Vias for 3D ICsJesal ZaveriCalvin R. King Jr.Hyung Suk YangMuhannad S. Bakir
- Critical Issues of 3D High-Performance IC IntegrationsJohn H. Lau
- Development of Ultra-Thin Microelectronic Multi-chip AssembliesH.K. Charles Jr.A.S. FrancomacaroS.J. LehtonenA.C. KeeneyG.V. ClatterbaughC.V. Banda
- Thermal Characteristics for LSI Embedding Build-up PWBsShin-ya AmakaiTsuyoshi TsunodaKohei OhtaShuji SagaraYoshitaka Fukuoka
- TLS-Dicing – The Key to Higher Yield and Throughput for Thin WafersHans-Ulrich ZuehlkeGabriele EberhardtRonny UllmannMike Lerner
- Active Demonstration of a Passively Self-Aligned, Multi-Chip Package using Proximity Communication in a Switching FabricIvan ShubinJohn E. CunninghamHans EberleRobert DrostNils GuraDavid HopkinsAshok V. Krishnamoorthy
- An Overview -Advanced Packaging for Solid State Light Emitting Diode (SSLED) LightingRajen Chanchani
- Bridging the Manufacturing Gap between Macro and Micro DevicesArthur L. Chait
- A Direct Fanning-out Packaging Technology using Cu Base Plate for Embedded Fine-pad-pitch LSIHideya MuraiKentaro MoriKouji SoejimaYuji KayashimaTakehiko MaedaTakuo FunayaKatsumi KikuchiKatsumi MaedaMasaya KawanoShintaro Yamamichi
- Hermetic Packaging for Highly Space-Constrained ApplicationsCaroline K. BjuneThomas F. MarinisJoseph W. Soucy
- CCA Passive Vibration DamperJoe VeceraBennion Cannon
- Packaging of High Temperature 50 kW SiC Motor Drive Modules for Hybrid-Electric VehiclesB. McPhersonJ. HornbergerJ. BourneA. LostetterR. SchupbachR. ShawB. ReeseB. RowdenA. MantoothS. AngJ. BaldaK. OkumuraT. Otsuka
- Small Surface Probes for Solar System ExplorationJ. C. ReddickB. H. KelsicC. M. CottinghamS. RoarkW. Tandy
- Encapsulation of Power Modules for Extreme Environment ElectronicsGona RaoSrikanth KulkarniFred BarlowAicha Elshabini
- Investigation of SiC Power Module Requirements for Smart Grid ApplicationsYuanbo GuoPitfee JaoGangyao WangYu DuSubbashish BhattacharyaDouglas C. Hopkins
- Near-Hermetic High Power Package using Liquid Crystal Polymer for 4-Watt Ka-Band Amplifier with Sparse Thermal Vias for Cost ReductionCheng ChenAnh-Vu Pham
- Optimizing Low Pass Filter Bandwidth for Generating Electrical Duobinary Signal for 40 Gb/s Optical Duobinary SystemsA. RahmanM. BromanM. Howieson
- Design of Low Phase Noise Cross-coupled VCO in 90nm CMOS TechnologyLu WangPrasanta Ghosh
- Column Distribution Analysis and RF Characterization of High-Density Vertical Interconnections Created by Magnetically Aligned Anisotropic Conductive AdhesiveSungwook MoonWilliam J. Chappell
- Substrate Integration of Widely Tunable Bandpass FiltersHjalti H. SigmarssonHimanshu JoshiSungwook MoonDimitrios PeroulisWilliam J. Chappell
- Microwave Characterization and Performance Assessment of Polymer-Magnetic Nanocomposites using Transmission-Line Based Microwave ResonatorsCesar A. Morales-SilvaJulio DewdneySayan ChandraSusmita PalKristen StojakHariharan SrikanthThomas WellerJing Wang
- Precious Metal FinancingPaul M. Angland
- Cost Effective Use of Gold in Thick Film ConductorsSamson ShahbaziMark Challingsworth
- Optimization of Silver Powder Production through Factorial ExperimentationKirk McNeillyLouis A. Johnson
- Gold: The High Reliability Choice in Semiconductor PackagingRichard HollidayLee Levine
- A Design Rule for 3D TSV Technology to Avoid Radial Cracking in Silicon InterposerZhen Zhang
- Nickel Palladium-Based Pads for Higher Reliability in Au Wire ProcessAsaf HashmonaiAlon MenachePetra Backus
- Reliability of WLP Structures Fabricated with ALX Dielectric PolymerAlan HuffmanJeffrey PiascikPhilip Garrou
- Continuous Au-Sn-Ni-Cu-Pb (ASN-CP) Layer Formation on Double Tin and Wicked Thick-Au/Ni Plated Printed Circuit BoardsJeffrey M. JenningsDonna GerrityCarlyn SmithPatricia Olszewski
- Interconnection Design and Impact Life Prediction Subjected to Board Level Drop TestChan-Yen ChouChao-Jen HuangTuan-Yu HungKuo-Ning Chiang
- Silver Epoxy Filled Via Analysis for High Reliability RF MCM MicroelectronicsJoe KreuzpaintnerKaren WooldridgeDonna GerrityBill ClarkHector Deju
- Monte Carlo Simulation of Void Concentrations in Surface Mounted Solder JointsJacob C. BurkeJohn W. EvansKamili Jackson
- Challenges of Supporting 3D IC and 3D Package Integration in the Design SpaceWilliam Acito
- Multi-Components Integration in a SIPBenoît HaentjensAlain LeborgneErwan FournM’Hamed DrissiGérald ChrétienYan Haentjens
- Design and Reliability of μPILR™ Package-on-Package (PoP)Ilyas MohammedPhil Damberg
- Novel Multi Chip Packaging Method Using Stochastic Self AssemblyBernd ScholzSourin Bhattacharya
- High Accuracy Placement Enabling High Density and Fine Pitch in 3D-IC with High Density TSV, with Chip to Wafer (C2W) Bonding ApproachGilbert LecarpentierJean Stephane MottetFrançois Marion
- Side Mount Package (SMP) for Ultra-High Density Memory ApplicationsMyung Jin YimJason BrandChan Yoo
- 3D Integration Technologies for Miniaturized Tire Pressure Monitor System (TPMS)Nicolas LietaerMaaike M. V. TakloArmin KlumppJosef WeberPeter Ramm
Lau, John H. 2026. “Critical Issues of 3D High-Performance IC Integrations.” IMAPSource Proceedings 2009 (Symposium): 585–92. https://doi.org/10.4071/001c.162597.