Reliability Evaluation of Lead-Free Solders for Automotive Applications

Y.K. Sa; Yeong K. Kim; Junghwan Bang; Junki Kim; Sehoon Yoo; Changwoo Lee

doi:10.4071/001c.161831

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Sa, Y.K., Yeong K. Kim, Junghwan Bang, Junki Kim, Sehoon Yoo, and Changwoo Lee. 2026. “Reliability Evaluation of Lead-Free Solders for Automotive Applications.” IMAPSource Proceedings 2009 (Symposium): 190–94. https://doi.org/10.4071/001c.161831.

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