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ISSN 2380-4505
Symposium Proceedings
Vol. 2009, Issue Symposium, 2009May 07, 2026 EDT

Effect of Temperature Cycling Parameters on the Durability of Pb-free Solders

Michael Osterman, Preeti Chauhan,
solder jointsPb-free soldertemperature cyclingreliability
https://doi.org/10.4071/001c.161902
IMAPSource Conference Papers
Osterman, Michael, and Preeti Chauhan. 2026. “Effect of Temperature Cycling Parameters on the Durability of Pb-Free Solders.” IMAPSource Proceedings 2009 (Symposium): 332–37. https://doi.org/10.4071/001c.161902.
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