ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009April 29, 2026 EDT
Improvement in Flip-Chip Bonding by Reduction of Oxides Using Hydrogen Radicals
Improvement in Flip-Chip Bonding by Reduction of Oxides Using Hydrogen Radicals
Nakashima, Tsuyoshi, Koji Miyamoto, Michihiro Sato, Kanta Nogita, and Akira Izumi. 2026. “Improvement in Flip-Chip Bonding by Reduction of Oxides Using Hydrogen Radicals.” IMAPSource Proceedings 2009 (Symposium): 1028–31. https://doi.org/10.4071/001c.161490.
