Effects of Solder Voids on Thermal and Reliability Performances of PQFN Packages

Youmin Yu; Victor A. Chiriac

doi:10.4071/001c.161907

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Yu, Youmin, and Victor A. Chiriac. 2026. “Effects of Solder Voids on Thermal and Reliability Performances of PQFN Packages.” IMAPSource Proceedings 2009 (Symposium): 354–59. https://doi.org/10.4071/001c.161907.

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