ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009June 22, 2026 EDT
Column Distribution Analysis and RF Characterization of High-Density Vertical Interconnections Created by Magnetically Aligned Anisotropic Conductive Adhesive
Column Distribution Analysis and RF Characterization of High-Density Vertical Interconnections Created by Magnetically Aligned Anisotropic Conductive Adhesive
Moon, Sungwook, and William J. Chappell. 2026. “Column Distribution Analysis and RF Characterization of High-Density Vertical Interconnections Created by Magnetically Aligned Anisotropic Conductive Adhesive.” IMAPSource Proceedings 2009 (Symposium): 706–10. https://doi.org/10.4071/001c.163696.