ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009May 06, 2026 EDT
Effect of Vibration on Lead-Free Solder Joint Reliability Under Temperature Changes for Automotive Electronics
Effect of Vibration on Lead-Free Solder Joint Reliability Under Temperature Changes for Automotive Electronics
Yoo, Sehoon, Y.K. Sa, Yeong K. Kim, Sanghyun Kwon, and ChangWoo Lee. 2026. “Effect of Vibration on Lead-Free Solder Joint Reliability Under Temperature Changes for Automotive Electronics.” IMAPSource Proceedings 2009 (Symposium): 215–19. https://doi.org/10.4071/001c.161841.