A Study of the Influence of FIP Bead Shape on Compression Force in PCB/Shield Assemblies

Claudine Y. Lumibao; Hui Ye; Douglas S. McBain

doi:10.4071/001c.160729

Loading [Contrib]/a11y/accessibility-menu.js

Lumibao, Claudine Y., Hui Ye, and Douglas S. McBain. 2026. “A Study of the Influence of FIP Bead Shape on Compression Force in PCB/Shield Assemblies.” IMAPSource Proceedings 2009 (Symposium): 072–078. https://doi.org/10.4071/001c.160729.

View more stats