ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009April 09, 2026 EDT
An Interconnection Verification Method and a New Substrate Option for Cu Pillar Flip-chip Module Applications
An Interconnection Verification Method and a New Substrate Option for Cu Pillar Flip-chip Module Applications
Morris, Scott, Jon Chadwick, Terry Glascock, John Czarnowski, Mike Ferrara, Don Leahy, and Shannon Pan. 2026. “An Interconnection Verification Method and a New Substrate Option for Cu Pillar Flip-Chip Module Applications.” IMAPSource Proceedings 2009 (Symposium): 912–15. https://doi.org/10.4071/001c.160352.