ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009June 22, 2026 EDT
Challenges of Supporting 3D IC and 3D Package Integration in the Design Space
Challenges of Supporting 3D IC and 3D Package Integration in the Design Space
Acito, William. 2026. “Challenges of Supporting 3D IC and 3D Package Integration in the Design Space.” IMAPSource Proceedings 2009 (Symposium): 789–93. https://doi.org/10.4071/001c.163725.