Solder Jetting - A Versatile Packaging and Assembly Technology for Hybrid Photonics and Optoelectronical Systems

Erik Beckert; Thomas R. Oppert; Ghassem Azdasht; Elke Zakel; Thomas R. Burkhardt; Marcel Hornaff; Ingo Scheidig; Ramona Eberhardt; Andreas Tünnermann; Frank Buchmann

doi:10.4071/001c.162052

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Beckert, Erik, Thomas R. Oppert, Ghassem Azdasht, Elke Zakel, Thomas R. Burkhardt, Marcel Hornaff, Ingo Scheidig, Ramona Eberhardt, Andreas Tünnermann, and Frank Buchmann. 2026. “Solder Jetting - A Versatile Packaging and Assembly Technology for Hybrid Photonics and Optoelectronical Systems.” IMAPSource Proceedings 2009 (Symposium): 406–12. https://doi.org/10.4071/001c.162052.

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