ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009April 16, 2026 EDT
Modeling and Analysis of a New Packaging Structure for Noise Isolation in Mixed- Signal Systems
Modeling and Analysis of a New Packaging Structure for Noise Isolation in Mixed- Signal Systems
Ndip, Ivan, Stephan Guttowski, and Herbert Reichl. 2026. “Modeling and Analysis of a New Packaging Structure for Noise Isolation in Mixed- Signal Systems.” IMAPSource Proceedings 2009 (Symposium): 464–53. https://doi.org/10.4071/001c.160725.