ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009April 29, 2026 EDT
Laser Based Assembly of Ultra Fine Pitch Bumped ICs For Chip-on-Chip Proximity Coupled Applications
Laser Based Assembly of Ultra Fine Pitch Bumped ICs For Chip-on-Chip Proximity Coupled Applications
Strandjord, Andrew, Thorsten Teutsch, Ghassem Azdasht, and Matt Giere. 2026. “Laser Based Assembly of Ultra Fine Pitch Bumped ICs For Chip-on-Chip Proximity Coupled Applications.” IMAPSource Proceedings 2009 (Symposium): 1032–38. https://doi.org/10.4071/001c.161491.