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ISSN 2380-4505
Symposium Proceedings
Vol. 2009, Issue Symposium, 2009May 27, 2026 EDT

Warpage Control of Thermally Enhanced PBGA Package with Internal Heat Spreader during Reliability Test

Min Ding, BY Low, James Guajardo, Harold Downey, Sheila Chopin,
WarpageCu AlloySofteningBall Grid ArrayReliability
https://doi.org/10.4071/001c.162590
IMAPSource Conference Papers
Ding, Min, BY Low, James Guajardo, Harold Downey, and Sheila Chopin. 2026. “Warpage Control of Thermally Enhanced PBGA Package with Internal Heat Spreader during Reliability Test.” IMAPSource Proceedings 2009 (Symposium): 544–51. https://doi.org/10.4071/001c.162590.
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