Development of Wafer Level Embedded SiP (System in Package) for Mobile Application

In-Soo Kang; Gi-Jo Jung; Byoung-Yool Jeon

doi:10.4071/001c.162072

Loading [Contrib]/a11y/accessibility-menu.js

Kang, In-Soo, Gi-Jo Jung, and Byoung-Yool Jeon. 2026. “Development of Wafer Level Embedded SiP (System in Package) for Mobile Application.” IMAPSource Proceedings 2009 (Symposium): 482–88. https://doi.org/10.4071/001c.162072.

View more stats