ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009May 11, 2026 EDT
Development of Wafer Level Embedded SiP (System in Package) for Mobile Application
Development of Wafer Level Embedded SiP (System in Package) for Mobile Application
Articles in Vol. 2009, Issue Symposium, 2009
Vol. 2009, Issue Symposium, 2009
- A New Type of Reconfigurable Antenna for Multi-band Wireless CommunicationChang-Chih LiuKuo-Chiang ChinWei-Ting ChenChang-Sheng ChengLi-Chi Chang
- The Design and Integration of a Quasi-Distributed Tunable UHF FilterEric E. HoppenjansWilliam J. Chappell
- A Process to Produce Low Cost Solder Balls in Custom SizesFred HaringJacob BaerSyed Sajid AhmadAaron Reinholz
- Modeling and Analysis of Electromagnetic Field Distribution in Vicinity of Patch Antennas at Millimeter-wave FrequenciesFlorian OhnimusIvan NdipEge EnginStephan GuttowskiHerbert Reichl
- Halogen Free and Thermal Stable Novolac Derivatives and Their Properties in Epoxy CompositesH. H. WuW. T. YangS. F. LiuC. C. Shieh
- Design and Integration of a Planar EBG for UWB ApplicationsIvan NdipMicha BierwirthEge EnginStephan GuttowskiHerbert Reichl
- Deposition of Thick Film Fine Line Patterns by Direct WritingMartin BursikJirí HladíkIvan Szendiuch
- The Cleaning Effectiveness in Electronics Assembly ProcessVladimír SítkoMichal ŠafferIvan SzendiuchMartin Buršík
- Intelligent Power Grid Simulation Hardware DesignJohn C. Browne Jr.Sean DevensSean JainarineOrlando GonsalvesSon NguyenZ. Joan Delalic
- What Is Halide-Free and What Does It Mean to Me?John C. Vivari
- Evaluation of the Ball Grid Array (BGA) Technology with a View to the Space-use ApplicationKoichi ShinozakiNorio NemotoTsuyoshi NakagawaYoshihiro Tokue
- Decision Matrix as a Tool for Pb-Free Alloy SelectionPedro O. QuinteroRicky ValentínDavid Ma
- An Investigation of Materials Selection and Manufacturing Process on Resulted Device Alpha Emissivity LevelsPeng SuRick WongShi-Jie WenAndy TsengJimmy ChenSimon Li
- A New Technique for Testing Copper Stud BumpsStephen ClarkAlan King
- An Interconnection Verification Method and a New Substrate Option for Cu Pillar Flip-chip Module ApplicationsScott MorrisJon ChadwickTerry GlascockJohn CzarnowskiMike FerraraDon LeahyShannon Pan
- Electromigration and Annealing Kinetics of Cu pillarMyeong-Hyeok JeongJae-Won KimGi-Tae LimByoung-Joon KimKiwook LeeJaedong KimYoung-Chang JooYoung-Bae Park
- Design and Process of 3D MEMS PackagingJohn H. Lau
- LCP Properties Ideal for Miniaturization Trend in Electronic IndustryEdson Ito
- High Density Hearing Aid Chip PackagingJohn DzarnoskiDoug Link
- Physiological Monitoring by “Credit Card”Harry K. Charles Jr.Russell P. Cain
- Multiple Gas Sensing Device Based on Nano-Porous Structure of Zeolite Coated with Nile Red DyeSon NguyenZ. Joan DelalicDavid M. KargboZameer Hasan
- Characterization of Extent of Cure of Form-in-Place CompoundsHui YeClaudine LumibaoDouglas S. McBain
- Modeling and Analysis of a New Packaging Structure for Noise Isolation in Mixed- Signal SystemsIvan NdipStephan GuttowskiHerbert Reichl
- A Practical Shielding Effectiveness Evaluation of EcE Gaskets Incorporating Accelerated AgingDouglas S. McBainTam ChauShelby BallRobert Antonio
- The Hidden Component of High Speed Filter Design: The Footprint InfluenceA. RahmanM. BromanM. Howieson
- Compression Force of a Form-In-Place (FIP) Conductive Elastomer EMI Shielding Gaskets: Theory, Measurement Techniques, and ApplicationHui YeClaudine Y. LumibaoDouglas S. McBain
- A Study of the Influence of FIP Bead Shape on Compression Force in PCB/Shield AssembliesClaudine Y. LumibaoHui YeDouglas S. McBain
- Evaluation of Electroless Nickel Electroless Palladium (ENEP) finish as a replacement for Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) for Gold Wirebonding and SAC305 SolderabilityJaspreet GandhiShijian LuoTom Jiang
- New PCB Materials for Low Skew Close Phase Matching in 10Gbps Differential System DesignsEdward P. SayreSunichi MaedaShinji Yoshikawa
- High-performance Optical Silicone for High Power LED packagesYeong-Her LinJiun Pyng YouFrank G. Shi
- Fabrication of 3-D Microstructures with Permanent Dielectric Dry FilmTobias BaumgartnerKarin HauckKai ZoschkeMichael TöpperHidetaka UnoWerner LiebschHao YunMats J. EhlinKarl H. Dietz
- The Effect of Test Conditions on HAST and THB Reliability Testing of Thermal Interface Material, and the Introduction of an Improved Thermal Interface MaterialAndy DelanoNatalie MerrillRichard Xu
- Crystallographic Texture and Whisker Growth in Electroplated Sn and Sn-Alloy FilmsAaron PedigoPylin SarobolJohn BlendellPeng SuCarol Handwerker
- Impact of SMT Assembly Process on Tin Whisker Risk MitigationChieh-Ju LeeGuhan SubbarayanLi LiJie XuePeter VerbiestQuyen Chu
- Comparison of Whisker Growth from Pressure-Induced and Environment-Induced Whisker Growth Test MethodsMichael OstermanLyudmyla PanashchenkoAlex HeronimePeng Su
- Case Study: Bright Tin Whisker Risk in PB-free Connector ApplicationsJames HenziCJ LeeDamon NorthropHongtao MaTae-kyu LeeBill ReynoldsMason Hu
- Grain Orientation and Microstructure Evolution in Sn-Ag-Cu Solder Joints as a Function of Position in Ball Grid Array PackagesTae-Kyu LeeBite ZhouLauren BlairKuo-Chuan LiuThomas R. Bieler
- Effect of Germanium addition to Sn3.5Ag Lead Free Solder System for Overall BGA Package Robustness ImprovementEu Poh LengWong Tzu LingMin DingNowshad AminIbrahim AhmadTay Yee HanA.S.M.A. Haseeb
- Characterization of SAC Solder Microstructure Evolution During Thermal Cycling with Statistical and In-situ MethodsBite ZhouThomas R. BielerGuilin WuStefan ZaeffererTae-kyu LeeKuo-Chuan Liu
- Low-Cost and Reliable Packaging Technology for Stacked MCP with MEMS and Control IC ChipsMitsuyoshi EndoAkihiro KojimaYoshiaki ShimookaYoshiaki SugizakiHiroaki YamazakiEtsuji OgawaTamio IkehashiTatsuya OhguroSusumu ObataYusaku AsanoTakeshi MiyagiIkuo MoriYoshiaki ToyoshimaHideki Shibata
- Mechanically Punched Micro Via Fabrication Process in LCP Substrate for RF-MEMS and Related Electronic Packaging ApplicationsMohammad K. ChowdhuryLi SunShawn CunninghamAjay P. Malshe
- Analysis of MEMS Structure Sidewalls for Carbon and Fluorinated Residue with SEM, EDS and TSAColin StevensRobert DeanLee Levine
- Design of Multiwall Carbon Nanotube Based Embedded InductorsBruce C. Kim
- Near Chip Scale Package for High Power, Big Chip LEDsPaul J. PanaccioneJay G. Liu
- Mechanical Analysis on Ball Bond Lifting of Wire Bonding in an LED Package for Backlight UnitJong Woon KimShan GaoSi Joong YangSeog Moon Choi
- Polarization Recycling LED Module for Pico ProjectorY. ChiW.P. TangS.L. ChenC.J. Tsai
- Determination of Optimal Component Spacing in a High Power Light Emitting Diode Array Assembly for Solid State LightingY. S. ChanS. W. Ricky Lee
- Void-Free Fluxless Solder Bonding of CPV Solar CellsWei ShiPaul J. BarnesDavid Muhs
- Parallel Algorithms for Power and Signal Integrity Analysis of High-Speed DesignsR. AcharH. DhindsaN. NakhlaD. PaulM. Nakhla
- Full-Wave Electromagnetic Characterization and Measurement of Wirebond Transitions on High Temperature Co-fired Ceramics (HTCC) and Low Temperature Co-fired Ceramic (LTCC) Substrates For Broadband Package DesignsJerry AguirreMarcos VargasJason BastDavid O’NeillSteve HiraChen Wang
- Embedding the Footprint into Very High Frequency Surface Mount Components through De-embedding OptimizationA. RahmanM. BromanM. Howieson
- Comprehensive Multilayer Substrate Models for Co-Simulation of Power and Signal IntegrityRenato Rimolo-DonadioXiaomin DuanHeinz-Dietrich BrünsChristian Schuster
- Reduction of Signal Line to Power Plane Coupling Using Controlled-Return-Current Transmission LinesA. Ege EnginIvan Ndip
- Impact of Metal Fill on On-Chip Interconnect PerformanceVikas S. ShilimkarSteven G. GaskillAndreas Weisshaar
- Improvement of Adhesion and Reliability of Conductive Inks on Flexible Liquid Crystal Polymer SubstratesD. MuseS. PritchardE. MacDonaldR. WickerX. ChenM. NewtonK.H. Church
- Polymer Nanocomposites, Printable and Flexible Technology for Electronic PackagingRabindra N. DasFrank D. EgittoBill WilsonMark D. PoliksVoya R. Markovich
- Direct Print Technology for Fabricating Mechanical SensorsXudong ChenKen ChurchDan MuseDavid RobersonMiguel AlamilloEric E. MacDonaldRyan WickerHelena RonkainenSimo VarjusJukka Paro
- Low Temperature Sintering Nanoparticle Inks for Printed Electronic DevicesZhihao YangZhiyong XuLiwei HuangHoward Wang
- Evaluation of Tool for Processing Metallic Conductive Inks on Low Temperature SubstratesS. FarnsworthI. RawsonK. MartinK. A. SchroderD. Pope
- Inkjet Printing Approach to Fabricate Non-sintered Dielectric Film with High Packing Density for 3D Package Integration TechnologyJihoon KimHun Woo JangEunhae KooHyo Tae KimYoung Joon YoonJong-hee Kim
- Underfill Selection for Flip Chip BGA Warpage ControlAntony LinCY LiMeng-Kai ShihYi-Shao LaiBernd AppeltAndy Tseng
- Flip Chip Process Using the Cu-Sn-Cu Double-Pillar-Bump BondingJung-Yeol ChoiMin-Young KimTae-Sung Oh
- Improvement in Flip-Chip Bonding by Reduction of Oxides Using Hydrogen RadicalsTsuyoshi NakashimaKoji MiyamotoMichihiro SatoKanta NogitaAkira Izumi
- Laser Based Assembly of Ultra Fine Pitch Bumped ICs For Chip-on-Chip Proximity Coupled ApplicationsAndrew StrandjordThorsten TeutschGhassem AzdashtMatt Giere
- Electromigration Study of μPILR™ Platform for Fine-Pitch Flip chip InterconnectsPiyush SavaliaRajesh KatkarYoshikuni NakadairaKyongmo BangBahareh BanijamaliIlyas MohammedLaura Mirkarimi
- Thermosonic Gold to Gold Interconnect (GGI) Flip Chip Bonding for 7mm2 DiePhilip Couts
- New Methods for Mechanical Mating Characterization of Surface Mount Technology Card to Board InterconnectionsJohn G. TorokWilliam L. BrodskyShawn CanfieldHien P. DangDavid L. EdwardsMark K. HoffmeyerVijay KhannaEric J McKeeverArvind K. SinhaSri Sri-Jayantha
- Production Measurement of Frequency Dependent Attenuation and Phase Constant of PCB TracesJohn DiTucciRoger Krabbenhoft
- A Case Study of the Impact of Fabrication Processes on PCB Broadband Electrical CharacteristicsJason LinAlbert HuangOhio HuangSteven Chen
- A Comparative Study of Microstrip, Stripline and Coplanar Lines on Different Substrate Technologies for High-Performance ApplicationsRobert ErxlebenIvan NdipLars BrusbergHenning SchröderMichael TöpperWolfgang ScheelStephan GuttowskiHerbert Reichl
- Newly Developed Low-Transmission-Loss Multilayer Materials for PWBs Applied to High GHz BandsHikari MuraiYasuyuki MizunoHiroshi ShimizuMakoto (Mak) KatoKenichi (Ken) Ikeda
- A Novel Halogen Free and Low Dk/Df Laminate Material for High Frequency ApplicationSanny HeBill Weng
- A Novel Green Process to Manufacture Ultra High Density Packaging SubstratesChih Kuang Yang
- Reliability Evaluation of Lead-Free Solders for Automotive ApplicationsY.K. SaYeong K. KimJunghwan BangJunki KimSehoon YooChangwoo Lee
- Prognostication For Impending Failure in Leadfree Electronics Subjected to Shock and Vibration Using Resistance SpectroscopyPradeep LallRyan LoweJeff SuhlingKai Goebel
- Component Quality Defects: Identification, Investigation & RemediationD. Michael Flint
- A High-Temperature, High-Voltage Linear Regulator in 0.8-μm BCD-on-SOIC. SuM. A HuqueB. J. BlalockS. K. IslamL. M. TolbertR. L. Greenwell
- Effect of Vibration on Lead-Free Solder Joint Reliability Under Temperature Changes for Automotive ElectronicsSehoon YooY.K. SaYeong K. KimSanghyun KwonChangWoo Lee
- A High-Temperature, High-Voltage SOI Gate Driver IC with High Output Current and On-Chip Low-Power Temperature SensorMohammad A. HuqueLeon M. TolbertBenjamin J. BlalockSyed K. Islam
- Thermal System Identification Analyses of Chip Interconnects to Facilitate DVFS ImplementationSai AnkireddiDavid Copeland
- HotPak: A Tool For Rapid Thermal Mapping & Leakage Power Analysis of Flip-Chip PackagesSai AnkireddiDavid CopelandStanley Pecavar
- Vaporizable Dielectric Fluid Cooling of IGBT Power SemiconductorsDavid L. Saums
- Thermal Management of a Planar Magnetic Micro-TransformerYazdan P. RaziBob Roohparvar
- A Stochastic Coolability Analysis For A Microprocessor Considering Chip Power FluctuationSai Ankireddi
- Characterization of LTCC Material at G-bandNurul OsmanRobert LeighCharles Free
- Thermomechanical Finite Element Techniques in Multilayer Ceramic Package DesignMark EblenNobuo TakeshitaFranklin Kim
- DuPontTM Green TapeTM 9K7 Low Temperature Co-fired Ceramic (LTCC) Low Loss Dielectric System for High Frequency ApplicationsK.E. SoudersK.M. NairM.F. McCombsJ.M. ParisiD.M. Nair
- Effect of Stress on the Densification of a Low-Temperature Cofired Ceramic (LTCC) System Under Constrained SinteringJui-Chuan ChangJau-Ho JeanYao-Yi Hung
- LTCC Ka-Band Switch Matrix Experiment for On-Orbit VerificationS. HumblaJ. MüllerR. StephanD. StöpelJ.F. TrabertG. VogtM.A. Hein
- New Plateable Thick Film Silver Conductors for DuPont™ Green Tape™ Low Temperature Co-Fired Ceramic (LTCC)Michael A. SkurskiK. M. NairDavid Shields
- Development of an AlN HTCC Multilayer System with a Tungsten Cofiring MetallizationBernd JoedeckeMarco FritschChristel KretzschmarLars RebenklauAlexander Michaelis
- Environmental Conditions Impacts on PB-Free Solder Joint ReliabilityBo LiuTae-Kyu LeeKuo-Chuan Liu
- Lead-Free Solder-Joint-Reliability Model EnhancementJian MiremadiGreg HenshallAileen AllenElizabeth BenedettoMichael Roesch
- Advanced Lead-Free Server Hardware Reliability Test Methods: Power Age / Power Cycling and Four Point Bend Test Data ResultsMatthew KellyTimothy YoungerDavid Braun
- Effect of Temperature Cycling Parameters on the Durability of Pb-free SoldersMichael OstermanPreeti Chauhan
- Au-Ge based Candidate Alloys for High-Temperature Lead-Free Solder AlternativesVivek ChidambaramJohn HaldJesper Hattel
- Break Down Failure Process of the Flip Chip Bumps Caused by Current StressingShigeaki SuganumaToshio GomyoYuya YamagishiKei ImafujiMasaki SanadaYuko KarasawaKei MurayamaTakashi KuriharaYukiharu Takeuchi
- Effects of Solder Voids on Thermal and Reliability Performances of PQFN PackagesYoumin YuVictor A. Chiriac
- Second Bond Stitch Width Model as a Trend Solution for Lead Width ReductionTomer LevinsonMenache AlonShi Fei
- Accelerated Characterization of Bonding Wire MaterialsA. PequegnatM. MayerJ. PersicY. Zhou
- Practical Considerations for PowerRibbon® Bonding of Hybrid PackagesRichard Elliott
- Room Temperature Wedge-Wedge Ultrasonic Bonding using Aluminum Coated Copper WireRainer DohleMatthias PetzoldRobert KlengelHolger SchulzeFrank Rudolf
- Numerical Analysis of Ultra-High Frequency Wire BondingM. MayerY. Huang
- Study of Formation and Change of Intermetallic Compounds in Cu-Au and Au-Al Systems for Copper on Gold BondingYingwei JiangYoumin YuWeimin ChenSonder WangRonglu Sun
- Odd-Form Factor Package Wire Bond Case StudiesDaniel D. Evans
- Solder Jetting - A Versatile Packaging and Assembly Technology for Hybrid Photonics and Optoelectronical SystemsErik BeckertThomas R. OppertGhassem AzdashtElke ZakelThomas R. BurkhardtMarcel HornaffIngo ScheidigRamona EberhardtAndreas TünnermannFrank Buchmann
- The Challenge in Packaging Microelectronics and OptoelectronicsRick C. StevensFahad M. SiddiquiBrian L. UhlhornKevin J. Thorson
- Micron Level Placement Accuracy for Wafer Scale Packaging of P-Side Down Lasers in Optoelectronic ProductsDaniel D. Evans Jr.Zeger Bok
- Modeling Residual Stresses in Epoxies During CoolingRaymond A. PearsonSalvatore S. Cimorelli
- Laser Scribing of Copper/Low-k Dielectric Semiconductor Materials by Nanosecond and Ultrafast Pulsewidth LasersA. HooperD. BarsicH. ZhangJ. O’Brien
- Indium Thermal Interface Material Assembly Manufacturability and ReliabilitySean S. TooMohammad KhanEdwin GohXiaole ZhoaKee-Hean Keok
- Evaluation of a Novel Dielectric Material for Aluminum SubstratesMichael CreamerMark ChallingsworthSamson Shahbazi
- High-Quality CO2 Laser Machining of LTCC Structures for Thermal Management of a Group of Single-Emitter Laser DiodesAlberto Campos ZatarainAaron McKay McKayHoward J BakerDenis R HallMarc Desmulliez
- High Temperature Stamping Forging to Fabricate Fully Densified Copper Tungsten and Copper Molybdenum Heat Sink MaterialsGuosheng JiangZhifa WangYi GuKen Kuang
- Component Level Testing of Application Specific Conditions for Pressure Sensitive Adhesive Thermal Interface MaterialsHerman ChuAnusha Selvakumar
- Process and Reliability Advantages of AuSn Eutectic Die-AttachAmanda HartnettSteve Buerki
- Reliability Study of the Bump on Flexible Lead for Wafer Level PackagingI. KolbM. J. WolfO. EhrmannH. Reichl
- Development of Wafer Level Embedded SiP (System in Package) for Mobile ApplicationIn-Soo KangGi-Jo JungByoung-Yool Jeon
- Enhance Solder Ball Shear Value in SiP Embedded PackagesDyi-Chung Hu
- Microspring Characterization and Flip Chip Assembly ReliabilityB. J. ChengE.M. ChowD. DeBruykerC. ChuaK. SahasrabuddheI. ShubinJ. CunninghamY. LuoA. V. Krishnamoorthy
- Advanced Wafer-Level Integration Technology with Ultra Fine Pitch Redistributed Layers Between Heterogeneous DevicesYutaka OnozukaHiroshi YamadaAtsuko IidaKazuhiko ItayaHideyuki Funaki
- On the Use of Nanoscale Materials to Toughen Model EpoxiesR. A. PearsonP. DittanetL. BacigalupoY.-L. LiangR. Oldak
- Impact of Thermal History on Gap Filling Capability of Die Attach FilmYeqing SuWei ShenWeimin ChenDenis BaiVitto HuangBaoguan YinSonder Wang
- Reliability Impact of Defects in Lead-Free BGA Solder Joints – A Systematic StudyAnurag BansalKuo-Chuan LiuJie XueDave Towne
- A Test Platform for the Thermal, Electrical, and Mechanical Characterization of PackagesJustin SchauerNathaniel PinckneyNyles NettletonDarko Popovic
- Use of the Skin Effect for Detection of Interconnect DegradationMichael H. AzarianDaeil KwonMichael Pecht
- Effects of PCB Design Variations on the Reliability of Lead-Free Solder JointsHongtao MaKuo-Chuan LiuDong Hyun KimCherif Guirguis
- Warpage Control of Thermally Enhanced PBGA Package with Internal Heat Spreader during Reliability TestMin DingBY LowJames GuajardoHarold DowneySheila Chopin
- Analysis of Pb-free BGA Solder Joint Reliability DataWeidong XieMichael TsaiKuo-Chuan Liu
- A Coupling between Electromigration(EM) and Kirkendall Effect in Sn-3.5Ag/Cu Solder JointH.W. KangJin YuY. Jung
- Lithography and Wafer Bonding Solutions for 3D IntegrationThorsten MatthiasBioh KimEric PaboDustin WarrenMarkus WimplingerPaul Linder
- A Cost-Effective PVD Thin Film Deposition System for the 3-D TSV Barrier/Seed ApplicationAlex WangBiju NinanPramod GuptaRavi Mullapudi
- Dispensable 3D Electrical Interconnects - A Near TSV Back end Packaging SolutionJeff LealSuzette PangrleScott McGrathGrant VillavicencioKeith BarrieSimon McElrea
- Wafer Level Batch Fabrication of Silicon Microchannel Heat Sink and Electrical Through-Silicon Vias for 3D ICsJesal ZaveriCalvin R. King Jr.Hyung Suk YangMuhannad S. Bakir
- Critical Issues of 3D High-Performance IC IntegrationsJohn H. Lau
- Development of Ultra-Thin Microelectronic Multi-chip AssembliesH.K. Charles Jr.A.S. FrancomacaroS.J. LehtonenA.C. KeeneyG.V. ClatterbaughC.V. Banda
- Thermal Characteristics for LSI Embedding Build-up PWBsShin-ya AmakaiTsuyoshi TsunodaKohei OhtaShuji SagaraYoshitaka Fukuoka
- TLS-Dicing – The Key to Higher Yield and Throughput for Thin WafersHans-Ulrich ZuehlkeGabriele EberhardtRonny UllmannMike Lerner
- Active Demonstration of a Passively Self-Aligned, Multi-Chip Package using Proximity Communication in a Switching FabricIvan ShubinJohn E. CunninghamHans EberleRobert DrostNils GuraDavid HopkinsAshok V. Krishnamoorthy
- An Overview -Advanced Packaging for Solid State Light Emitting Diode (SSLED) LightingRajen Chanchani
- Bridging the Manufacturing Gap between Macro and Micro DevicesArthur L. Chait
- A Direct Fanning-out Packaging Technology using Cu Base Plate for Embedded Fine-pad-pitch LSIHideya MuraiKentaro MoriKouji SoejimaYuji KayashimaTakehiko MaedaTakuo FunayaKatsumi KikuchiKatsumi MaedaMasaya KawanoShintaro Yamamichi
- Hermetic Packaging for Highly Space-Constrained ApplicationsCaroline K. BjuneThomas F. MarinisJoseph W. Soucy
- CCA Passive Vibration DamperJoe VeceraBennion Cannon
- Packaging of High Temperature 50 kW SiC Motor Drive Modules for Hybrid-Electric VehiclesB. McPhersonJ. HornbergerJ. BourneA. LostetterR. SchupbachR. ShawB. ReeseB. RowdenA. MantoothS. AngJ. BaldaK. OkumuraT. Otsuka
- Small Surface Probes for Solar System ExplorationJ. C. ReddickB. H. KelsicC. M. CottinghamS. RoarkW. Tandy
- Encapsulation of Power Modules for Extreme Environment ElectronicsGona RaoSrikanth KulkarniFred BarlowAicha Elshabini
- Investigation of SiC Power Module Requirements for Smart Grid ApplicationsYuanbo GuoPitfee JaoGangyao WangYu DuSubbashish BhattacharyaDouglas C. Hopkins
- Near-Hermetic High Power Package using Liquid Crystal Polymer for 4-Watt Ka-Band Amplifier with Sparse Thermal Vias for Cost ReductionCheng ChenAnh-Vu Pham
- Optimizing Low Pass Filter Bandwidth for Generating Electrical Duobinary Signal for 40 Gb/s Optical Duobinary SystemsA. RahmanM. BromanM. Howieson
- Design of Low Phase Noise Cross-coupled VCO in 90nm CMOS TechnologyLu WangPrasanta Ghosh
- Column Distribution Analysis and RF Characterization of High-Density Vertical Interconnections Created by Magnetically Aligned Anisotropic Conductive AdhesiveSungwook MoonWilliam J. Chappell
- Substrate Integration of Widely Tunable Bandpass FiltersHjalti H. SigmarssonHimanshu JoshiSungwook MoonDimitrios PeroulisWilliam J. Chappell
- Microwave Characterization and Performance Assessment of Polymer-Magnetic Nanocomposites using Transmission-Line Based Microwave ResonatorsCesar A. Morales-SilvaJulio DewdneySayan ChandraSusmita PalKristen StojakHariharan SrikanthThomas WellerJing Wang
- Precious Metal FinancingPaul M. Angland
- Cost Effective Use of Gold in Thick Film ConductorsSamson ShahbaziMark Challingsworth
- Optimization of Silver Powder Production through Factorial ExperimentationKirk McNeillyLouis A. Johnson
- Gold: The High Reliability Choice in Semiconductor PackagingRichard HollidayLee Levine
- A Design Rule for 3D TSV Technology to Avoid Radial Cracking in Silicon InterposerZhen Zhang
- Nickel Palladium-Based Pads for Higher Reliability in Au Wire ProcessAsaf HashmonaiAlon MenachePetra Backus
- Reliability of WLP Structures Fabricated with ALX Dielectric PolymerAlan HuffmanJeffrey PiascikPhilip Garrou
- Continuous Au-Sn-Ni-Cu-Pb (ASN-CP) Layer Formation on Double Tin and Wicked Thick-Au/Ni Plated Printed Circuit BoardsJeffrey M. JenningsDonna GerrityCarlyn SmithPatricia Olszewski
- Interconnection Design and Impact Life Prediction Subjected to Board Level Drop TestChan-Yen ChouChao-Jen HuangTuan-Yu HungKuo-Ning Chiang
- Silver Epoxy Filled Via Analysis for High Reliability RF MCM MicroelectronicsJoe KreuzpaintnerKaren WooldridgeDonna GerrityBill ClarkHector Deju
- Monte Carlo Simulation of Void Concentrations in Surface Mounted Solder JointsJacob C. BurkeJohn W. EvansKamili Jackson
- Challenges of Supporting 3D IC and 3D Package Integration in the Design SpaceWilliam Acito
- Multi-Components Integration in a SIPBenoît HaentjensAlain LeborgneErwan FournM’Hamed DrissiGérald ChrétienYan Haentjens
- Design and Reliability of μPILR™ Package-on-Package (PoP)Ilyas MohammedPhil Damberg
- Novel Multi Chip Packaging Method Using Stochastic Self AssemblyBernd ScholzSourin Bhattacharya
- High Accuracy Placement Enabling High Density and Fine Pitch in 3D-IC with High Density TSV, with Chip to Wafer (C2W) Bonding ApproachGilbert LecarpentierJean Stephane MottetFrançois Marion
- Side Mount Package (SMP) for Ultra-High Density Memory ApplicationsMyung Jin YimJason BrandChan Yoo
- 3D Integration Technologies for Miniaturized Tire Pressure Monitor System (TPMS)Nicolas LietaerMaaike M. V. TakloArmin KlumppJosef WeberPeter Ramm
Kang, In-Soo, Gi-Jo Jung, and Byoung-Yool Jeon. 2026. “Development of Wafer Level Embedded SiP (System in Package) for Mobile Application.” IMAPSource Proceedings 2009 (Symposium): 482–88. https://doi.org/10.4071/001c.162072.