Reliability Impact of Defects in Lead-Free BGA Solder Joints – A Systematic Study

Anurag Bansal; Kuo-Chuan Liu; Jie Xue; Dave Towne

doi:10.4071/001c.162585

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Bansal, Anurag, Kuo-Chuan Liu, Jie Xue, and Dave Towne. 2026. “Reliability Impact of Defects in Lead-Free BGA Solder Joints – A Systematic Study.” IMAPSource Proceedings 2009 (Symposium): 516–23. https://doi.org/10.4071/001c.162585.

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