Thermomechanical Finite Element Techniques in Multilayer Ceramic Package Design

Mark Eblen; Nobuo Takeshita; Franklin Kim

doi:10.4071/001c.161853

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Eblen, Mark, Nobuo Takeshita, and Franklin Kim. 2026. “Thermomechanical Finite Element Techniques in Multilayer Ceramic Package Design.” IMAPSource Proceedings 2009 (Symposium): 268–74. https://doi.org/10.4071/001c.161853.

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