ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009May 11, 2026 EDT
High Temperature Stamping Forging to Fabricate Fully Densified Copper Tungsten and Copper Molybdenum Heat Sink Materials
High Temperature Stamping Forging to Fabricate Fully Densified Copper Tungsten and Copper Molybdenum Heat Sink Materials
Jiang, Guosheng, Zhifa Wang, Yi Gu, and Ken Kuang. 2026. “High Temperature Stamping Forging to Fabricate Fully Densified Copper Tungsten and Copper Molybdenum Heat Sink Materials.” IMAPSource Proceedings 2009 (Symposium): 459–63. https://doi.org/10.4071/001c.162065.