Flip Chip Process Using the Cu-Sn-Cu Double-Pillar-Bump Bonding

Jung-Yeol Choi; Min-Young Kim; Tae-Sung Oh

doi:10.4071/001c.161489

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Choi, Jung-Yeol, Min-Young Kim, and Tae-Sung Oh. 2026. “Flip Chip Process Using the Cu-Sn-Cu Double-Pillar-Bump Bonding.” IMAPSource Proceedings 2009 (Symposium): 1024–27. https://doi.org/10.4071/001c.161489.

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