Low-Cost and Reliable Packaging Technology for Stacked MCP with MEMS and Control IC Chips

Mitsuyoshi Endo; Akihiro Kojima; Yoshiaki Shimooka; Yoshiaki Sugizaki; Hiroaki Yamazaki; Etsuji Ogawa; Tamio Ikehashi; Tatsuya Ohguro; Susumu Obata; Yusaku Asano; Takeshi Miyagi; Ikuo Mori; Yoshiaki Toyoshima; Hideki Shibata

doi:10.4071/001c.161405

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Endo, Mitsuyoshi, Akihiro Kojima, Yoshiaki Shimooka, Yoshiaki Sugizaki, Hiroaki Yamazaki, Etsuji Ogawa, Tamio Ikehashi, et al. 2026. “Low-Cost and Reliable Packaging Technology for Stacked MCP with MEMS and Control IC Chips.” IMAPSource Proceedings 2009 (Symposium): 166–73. https://doi.org/10.4071/001c.161405.

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