ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009May 11, 2026 EDT
Reliability Study of the Bump on Flexible Lead for Wafer Level Packaging
Reliability Study of the Bump on Flexible Lead for Wafer Level Packaging
Kolb, I., M. J. Wolf, O. Ehrmann, and H. Reichl. 2026. “Reliability Study of the Bump on Flexible Lead for Wafer Level Packaging.” IMAPSource Proceedings 2009 (Symposium): 475–81. https://doi.org/10.4071/001c.162071.