ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009April 20, 2026 EDT
Grain Orientation and Microstructure Evolution in Sn-Ag-Cu Solder Joints as a Function of Position in Ball Grid Array Packages
Grain Orientation and Microstructure Evolution in Sn-Ag-Cu Solder Joints as a Function of Position in Ball Grid Array Packages
Lee, Tae-Kyu, Bite Zhou, Lauren Blair, Kuo-Chuan Liu, and Thomas R. Bieler. 2026. “Grain Orientation and Microstructure Evolution in Sn-Ag-Cu Solder Joints as a Function of Position in Ball Grid Array Packages.” IMAPSource Proceedings 2009 (Symposium): 142–49. https://doi.org/10.4071/001c.160910.