ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009June 22, 2026 EDT
Novel Multi Chip Packaging Method Using Stochastic Self Assembly
Novel Multi Chip Packaging Method Using Stochastic Self Assembly
Scholz, Bernd, and Sourin Bhattacharya. 2026. “Novel Multi Chip Packaging Method Using Stochastic Self Assembly.” IMAPSource Proceedings 2009 (Symposium): 807–12. https://doi.org/10.4071/001c.163728.