ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009June 22, 2026 EDT
Side Mount Package (SMP) for Ultra-High Density Memory Applications
Side Mount Package (SMP) for Ultra-High Density Memory Applications
Yim, Myung Jin, Jason Brand, and Chan Yoo. 2026. “Side Mount Package (SMP) for Ultra-High Density Memory Applications.” IMAPSource Proceedings 2009 (Symposium): 817–21. https://doi.org/10.4071/001c.163730.